EDI CON ACROSS CHINA is specifically designed to meet engineers where they are in 2021. The program combines a virtual event with two localized events in high-tech regions of China. The conference program is developed in collaboration with leading international technology companies in the areas of RF/microwave, components, test and measurement, software, cables/connectors, systems, and services.
The virtual conference, will take place 12-13 May with two days of online sessions, workshops, and keynotes from international speakers covering topics on 5G, WiFi, IoT, satellite, radar, and automotive.
Then, EDI CON ACROSS CHINA will launch a series of in-person localized conferences with stops in Shanghai (22-23 July) and Shenzhen (9-10 December), with planned tracks on semiconductor applications and design, 5G, and Radar/Automotive. The Shenzhen event will also include an exhibition with tabletop displays.
May 12-13, 2021 (Virtual)
July 22-23, 2021 (Shanghai)
December 9-10, 2021 (Shenzhen)
EDI CON China returns to Beijing in April 2022 with its hallmark in person event at the CNCC.